Reliability Engineering

Lexicon of Semiconductor Terms. Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices SMDs. Tech Brief tb363.2. Guidelines for Soldering Surface Mount Components to PC Boards. Tech Brief tb334.2. Decreasing Moisture Content of Epoxy. Calculation of Semiconductor Failure Rates. Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications. Use of Life Tested Parts. Estimated Failure Rates for Class T Products.

OVERVIEW

The web page rel.intersil.com presently has a traffic ranking of zero (the lower the more traffic). We have examined four pages inside the web site rel.intersil.com and found two websites interfacing with rel.intersil.com.
Pages Crawled
4
Links to this site
2

REL.INTERSIL.COM TRAFFIC

The web page rel.intersil.com is seeing varying quantities of traffic all round the year.
Traffic for rel.intersil.com

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Traffic ranking (by month) for rel.intersil.com

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Traffic ranking by day of the week for rel.intersil.com

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LINKS TO DOMAIN

Electronics Online Distance Learning - Computer Technology Courses

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WHAT DOES REL.INTERSIL.COM LOOK LIKE?

Desktop Screenshot of rel.intersil.com Mobile Screenshot of rel.intersil.com Tablet Screenshot of rel.intersil.com

REL.INTERSIL.COM SERVER

Our parsers revealed that a lone page on rel.intersil.com took four hundred and ninety-one milliseconds to load. I could not discover a SSL certificate, so therefore we consider this site not secure.
Load time
0.491 secs
SSL
NOT SECURE
Internet Protocol
192.157.181.15

SERVER OS AND ENCODING

We caught that rel.intersil.com is operating the Apache/1.3.26 (Unix) mod_auth_pgsql/0.9.12 mod_python/2.7.6 Python/2.1.1 PHP/4.3.2RC4 mod_layout/3.2 mod_perl/1.27 server.

HTML TITLE

Reliability Engineering

DESCRIPTION

Lexicon of Semiconductor Terms. Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices SMDs. Tech Brief tb363.2. Guidelines for Soldering Surface Mount Components to PC Boards. Tech Brief tb334.2. Decreasing Moisture Content of Epoxy. Calculation of Semiconductor Failure Rates. Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications. Use of Life Tested Parts. Estimated Failure Rates for Class T Products.

PARSED CONTENT

The web page had the following on the web site, "Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices SMDs." We saw that the web site said " Guidelines for Soldering Surface Mount Components to PC Boards." It also said " Decreasing Moisture Content of Epoxy. Calculation of Semiconductor Failure Rates. Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications. Use of Life Tested Parts. Estimated Failure Rates for Class T Products."

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